Note: This is our working copy of the technical program. Session
times and speakers are subject to change without notice. Due to a large
number of abstract submissions this
year, not all requests for oral
presentations could be accommodated….sorry about that.
Sunday Evening April 30, 2000
7:00 PM — 10:00 PM Opening reception and registration
Monday, May 1, 2000
7:30 AM - 8:00 AM Continental Breakfast
8:00 AM - 8:15 AM Welcome and Introductions
8:15 AM - 8:45 AM Plenary Talk: The History
of SIMS in the
8:45 AM - 9:15 AM Plenary Talk: SIMS Depth Profiling, Things your Mother Never Told You, Fred Stevie, Lucent Technologies.
9:15 AM - 9:45 AM Plenary Talk: Molecular
Dynamics Simulation of keV Particle Bombardment, Kristin Krantzman,
Department of Chemistry,
9:45 AM - 10:15 AM Morning Break
10:15 - 11:45 AM Technical Session 1- Metrology Challenges for the New Millenium (Chair: Jerry Hunter, Accurel Systems)
Ann Waldhauer, Applied Materials, Metrology for Silicon Germanium Epitaxy
Noble Johnson, Xerox PARC, Blue Laser Diodes-
Materials Issues in Relation to Device Performance
Lei Zhu, Data Storage Institute,
Ken Willey,
Atom Sciences, Inc, DNA Diagnostics by TOF SIMS
11:45 AM - 12:45 PM Lunch
12:45 PM - 1:30 PM Technical Session 2-
Introduction to the Research Activities of US SIMS Labs-
Short presentations will be given on the
capabilities and research interests of major US SIMS research labs.
1:30-1:45 PM - SIMS Workshop Business, ASTM Meeting
1:45 PM - 3:15 PM Technical Session 3 -Insulator/Geological/Isotopic Analysis by SIMS (Chairs: Al Fahey, NIST and Kevin McKeegan, UCLA)
Kevin McKeegan, UCLA, High precision isotope ratio measurements with a multiple collector SIMS
Rick Hervig,
Albert Fahey, NIST, Elemental and Isotopic Analysis of Geological and Insulating Samples by TOF -SIMS
Edward P. Vicenzi, Smithsonian Institution, High Spatial
Resolution Elemental Imaging of Natural Materials using the Focused Ion Beam
SIMS
3:15 PM - 3:30 PM Afternoon Break
3:30 PM - 5:00 PM Technical Session 4- New Developments for SIMS (Chair TBD)
Robert Odom, Charles Evans and Associates, Real
Time, In-Situ Depth Measurement of Sputtered Craters
Fred Stevie, Lucent Technologies, Sample for
Electron Beam Detection and Alignment
Lucille Giannuzi,
Igor Veryovkin,
5:00 PM - 6:30 PM Free Time/Instrument Company
Sponsored User Meetings
6:30 PM - 7:00 PM Social Mixer
7:00 PM - 10:00 PM Vendor Banquet- Short After Dinner
Presentations by Companies on their Newest Products
Presentations To be Given By (as of 4-4-2000)
Accurel Systems International Corp.
Atomika Instruments GmbH
CAMECA
Physical Electronics Inc.
Tuesday May 2, 2000
7:30 AM - 8:00 AM Continental Breakfast
8:00 AM 1 9:30 AM Technical Session 5- Semiconductor Applications of Time-of-Flight SIMS (Chair: Steve Hues, Motorola)
Scott Bryan, Physical Electronics, Trace Metal Analysis of Silicon Wafers by TOF-SIMS
Steven Hues, Motorola, MOS-13 Real World Use of TOF-SIMS in a Semiconductor FAB
J.J. Lee, Motorola, APRDL TOF-SIMS Detection of Organic Contamination in Semiconductor Wafer Fabrication
Ian Mowat, Charles Evans and Associates, Quantitative
Aspects of the Surface Analysis of Metals on Si
9:30 AM - 1 10:00 AM Morning Break
10:00 AM 111:30 AM Technical Session 6- Vendor Technical Session (Chair: Mark Woods, ARL)
Michel Schuhmacher, Cameca Instruments, On-Line
Crater Depth Measurements on a Magnetic Sector SIMS
S.B. Patel, Atomika Instruments America, Analysis of Small Areas using Low Energy SIMS
F. Reich, Physical Electronics, Recent Developments in SIMS at Physical
Electronics
11:30 AM - 12:30 PM Lunch
12:30 PM - 2:00 PM Technical Session 7 - New Approaches for SIMS/Surface Analysis (Chair: Pat Lindley, Charles Evans and Associates)
Steve Pachuta, 3M, Chemically-Nondestructive Depth Profiling Using Combined AFM/SIMS and Laser Desorption/SIMS
Claude Lechene,
Rainer Loesing,
Thomas Grehl, ION-TOF, A New Cs-Xe Co-sputtering Technique for
Ultrashallow Depth Profiling
2:00 PM — 3:30 PM Technical Session 8 - Quantitation SIMS/Depth Profiling (Chair: Richard Lareau, FAA)
Charles W. Magee, Evans East, Precision and Accuracy in SIMS Depth Profiling: What is the Difference and What are the Limitations?
Jennifer McKinley, Lucent Technologies, Quantification
of Varying Dose Implant Standards of P, F, and B in SiO2 for
Quantification of Highly-Doped Oxides
Richard Lareau, Federal Aviation Administration, In Situ Ion Implantation for Quantitative SIMS Analysis of Wide-Band Gap Device Structures
Stefanie Walz,
Bruno W. Schueler, Physical Electronics, Surface Metal Standards Produced by Ion Implantation through a Removable Layer
3:30 PM — 5:00 PM Technical Session 9 - Poster Session
1.
2. R. Brindos, University of Florida, Quality Control and Consistency
Checks When Using SIMS to Determine the Interactions between Arsenic,
Germanium, and Silicon Intersitials
3. S. F. Belykh,
4. John B. Cliff,
5. Chris Diehnelt,
6. Robert D. English,
7. Michael Geva, Lucent Technologies, SSRM – A Complementary Analytical
Technique to SIMS
8. G. M. Guryanov,
9. Philippe Holliger, Cameca, Depth Profiling of
Ultra Shallow As-implants in Si using MCs+ and MCs2+
10. Marc Juhel, STM Microelectronics, TOF-SIMS Depth Profiling of Thin
Oxynitride Film with MCs+ Ions
11. Wendy J. Justison, E.I. Dupont de Nemours, Exploring
the Combination of HPLC/SEC with ToF-SIMS
12. G. F. Kessinger, INEEL, High Temperature
Condensed Phase Mass Spectrometric Analysis
13. Patrick Keyes,
14. Jong Kim,
15. Unchul Lee, US Army Research Lab, Investigation of Anomalous n-type Behavior
in LWIR MBE Grown Hg1-xCdXTe Using Secondary Ion Mass
Spectrometry (SIMS)
16. Jennifer McKinley, Lucent Technologies, Line Scan Quantification of
Metal-Implanted Si Samples
17.
18. Patrick Schnabel, Charles Evans and Associates, Comparison
of ToF-SIMS and TD-GC/MS Detection Limits for the Analysis of Organic
Contamination on Wafer Surfaces
19. Igor Veryovkin, Argonne National Lab, A
Near-future Perspective of Computer Simulations of Ion Optics: Introducing a Virtual Instrument
20 W.
Vandervorst, IMEC, Influence of Oxygen on the Analysis of Oxynitrides:
N-Diffusion or Ionization
21. A. T. S. Wee,
22. Ming Hong Yang, Charles Evans and Associates, Accurate Near Surface Carbon Measurements Using Deconvolution Methods
23. Vladimir S. Zaitsev,
24. V. Zinoviev ,
25. Greg Gillen, NIST, Carbon Cluster Primary Ion Beams for SIMS
26. Greg Gillen and Albert Fahey, NIST, Preliminary Evaluation of an UltraFast Resistive Anode Encoder for SIMS Imaging Applications
27. Peter Chi, NIST, High Precision
Measurements of Arsenic Implantation Dose in Silicon by SIMS
28. Sonya Roberson, NIST , TBD
5:00 PM — 8:30 PM Lake Tahoe Dinner
Boat Cruise (Ski Run
Wednesday May 3, 2000
7:30 AM — 8:00 AM Continental Breakfast
8:00 AM — 9:45 AM Technical Session 10 - Mechanisms of Molecular Desorption/Polyatomic Primary Ion Beams for SIMS (Chairs, Greg Gillen and Mike VanStipdonk)
Dietmar Staple,
Kuang Jen Wu, Charles Evans and Associates, Highly Charged Ions for Organic SIMS
A. Delcorte,
Robert English,
Alger Pike,
9:45 AM — 10:00 AM Morning Break
10:00 AM — 12:20 PM Technical Session 11 - Polymer Characterization by SIMS (Chair: Sonya Roberson, NIST)
David Castner,
David Abmayr, Exxon, TOF-SIMS Imaging: Along the Polymer Delivery Chain
Birgit Hagenhoff, TASCON GmbH, SIMS Spectra
of Polymers: A Stepwise
Appoach to Interpretation
Joo-Woon Lee,SUNY Buffalo, A New Approach to the Direct Surface Determination of Biodegradable Polymers: in vitro Hydrolytic Degradation Study of Poly(glycolic acid) using Time-of-Flight Secondary Ion Mass Spectrometry (ToF SIMS) and Differential Scanning Calorimetry (DSC)
Pat Lindley, Charles Evans and Associates, Polymer
Characterization using TOF-SIMS
Kathy Lloyd, DuPont, Chemometric Methods for Surface Spectroscopic and Image Data Analysis, or How PCA can reveal what mere mortals cannot see (or are too lazy to ask for)
12:20 PM Closing Remarks