ANNUAL WORKSHOP ON SIMS

Agenda

Tentative Agenda -subject to change   >Download PDF Version here.

21st Annual Workshop on SIMS

Secondary Ion Mass Spectrometry

 

Organizing Committee:

 

Steven Hues, Micron Technology - Chairman

Greg Gillen, NIST - Chairman

Richard Lareau, DHS - Chairman

 

 

Monday May 12, 2008

12:00- 6:00 PM Registration and Vendor Exhibitor Setup 
6:00 – 10:00 PM Opening Reception

         

Tuesday - May 13, 2008

Tutorial Program (2008)

8:30 - 9:30 AM  

Cluster SIMS of Polymers and Related Materials, 
Christine Mahoney, NIST 

9:30 - 10:30 AM

Focused Ion Beam Technology, Fred Stevie, NCSU

10:30 – 11:00 AM

Break

11:00 – 12:00 AM 

Spectral Interpretation for TOF SIMS Mass Spectra, 
Alan Spool, Hitachi Global Storage

12:00 – 1:00 PM

Lunch

1:00 – 2:00 PM

Current Status of Atom Probe Mass Spectrometry, 
Paul Ronsheim, IBM 

2:00 – 3:00 PM  

Internal Energy Deposition, Measurement and Effects 
in Mass Spectrometry, Graham Cooks, Purdue University

3:00 – 3:30 PM

Break

3:30 – 4:30 PM

Depth Profiling 101, Artifacts and Profile Interpretation, 
Joe Bennett, ATDF

6:00-10:00 PM

Poster Session/Mixer

      

Wednesday – May 14, 2008

Technical Program

7:30 - 8:15 AM

Continental Breakfast

7:30 - 4:00 PM

Registration and Exhibitor Setup

8:15 - 8:30 AM

Welcome and Introductions 


Plenary Session 1 
Novel Developments in Mass Spectrometry 

8:30 - 9:00 AM

Ambient Ionization and Handheld Mass Spectrometers, 
R.G. Cooks, Purdue 

9:00 - 9:30 AM

Ion-Nanoparticle Interactions and Characterization of 
Nanomaterials by TOF-SIMS, Dan Gaspar, PNNL

9:30 - 10:00 AM

SIMS Imaging of Cancer Cells; Kuang Jen Wu, Lawrence Livermore 

10:00 - 10:30 AM

Break 


Plenary Session 2 
New Instrumental Developments for SIMS 

10:30- 10:50 AM

New TOF- SIMS Instrumentation for C60- SIMS – Overview, 
John Vickerman, UMIST

10:50 - 11:20 AM

SIMS Bioimaging with C60 and a Hybrid Quadrupole- Orthogonoal TOF Mass Spectrometer, Nick Winograd, Penn State University

11:20 - 11:50 PM

Imaging, Depth Profiling and MSMS Analysis on the Ionoptika J105, John Fletcher, UMIST

12:00 - 1:20 PM

Lunch


Related Techniques

1:20 - 1:40 PM

Development of a FIB SIMS Instrument, Fred Stevie, NCSU

1:40 - 2:00 PM

XPS, TEM, and SIMS Analysis of FIB Bombarded Surfaces at Various Ga+ Ion Energies, Lucille Giannuzzi, FEI

2:00 - 2:20 PM

Atom Probe and SIMS as Complementary Techniques for the Observation and Quantitative Measurement of Microstructures, 
F. Horreard, Cameca

2:20 - 2:40 PM

Die Packaging Preparation using FIB/SIMS, Jeff Chen, Freescale Semiconductor


  Special Historical Presentation:

2:40 - 3:20 PM

Thoughts on a 50 Year Journey in SIMS, Georges Slodzian, University Paris, Sud

3:20 - 3:40 PM

Break


SIMS Business Meeting/ASTM Committee Meeting

3:40 - 4:00 PM

SIMS Business Meeting (Richard Lareau)
ASTM Meeting/Workshop (Chair: Christine Mahoney)

4:00 - 6:00 PM

Vendor User Meetings- Cameca, Phi, Ion TOF


Vendor Dinner

7:00 - 10:00 PM         Vendor Dinner 

 

Thursday – May 15, 2008

Technical Program

7:30 - 8:15 AM       Continental Breakfast

7:30 - 4:00 PM        Registration

Cluster SIMS 

8:00- 8:20 AM

Mass Imaging with Swift Heavy Ions (MeV-SIMS),
J. Matsuo, Kyoto University 

8:20- 8:40 AM

Glycerol Microdrop Cluster SIMS, Tim Brewer, NIST 

8:40- 9:00 AM

Characterization of Individual Silver Nanoparticles and their Chemical Environment via Secondary Emission from Discrete Impacts of Aun and C60, S. Rakagopalachary, Texas A&M University

9:00- 9:20 AM

Energy Deposition during Molecular Depth Profiling with Cluster Ion Beams, Joe Kozole, Transportation Security Agency

9:20- 9:40 AM

High-Rate and Low-Damage Etching of Organic Materials with Large Gas Cluster Ions, S. Ninomiya, Kyota University

9:40- 10:00 AM

Break

Semiconductors 

10:00 - 10:30 AM

SIMS with Sub-keV O2+ Beams at Glancing Incidence, Jack Jiang, Freescale Semiconductor

10:30 - 10:50 AM

Application of TOF-SIMS and LEIS for the Characterization of Ultra-Thin Films, Ewald Niehuis, IonTOF

10:50 - 11:10 AM

Information Limits in SIMS Depth Profiling of Thin Films for Semiconductor Technology, A. Budrevich, Intel Corporation

11:10 - 11:30 AM

 An Accurate Depth Profiles within First Nanometers in Si based Semiconductor Structures using Ultra-low Ion Impact Energy SIMS, A. Merkulov, Cameca Instruments

11:30 - 11:50 AM

Qualitative and Quantitative Analysis of Silicon Oxynitride Layers – Comparison of Different SIMS Based Protocols, Christoph Schnouerer-Patschan, Cameca Instruments

11:50 - 12:50 PM

Lunch


Analysis of Organic Materials 

12:50 - 1:20 PM

Recent Developments in Organic Depth Profiling with Low Energy Cesium Ions, Laurent Houssiau, Belgium (invited tutorial)

1:20 - 1:40 PM

Desorption Electrospray Ionization Mass Spectrometry of Explosives, Chris Szakal, NIST

1:40 - 2:00 PM

3D Characterization of Drug Elution from a Coronary Stent by TOF-SIMS, Greg Fisher, Physical Electronics

2:00 - 2:20 PM

Mass Spectrometry Imaging of Lignocellulosic Materials, Zhen Li, University of Illinois at Urbana-Champaign

2:20 - 2:40 PM

Electron Beam and UV Photo-Patterning of Alkanethiolate Self-Assembled Monolayers (SAMs) Adsorbed on GaAs (001), Chuanzhen Zhou, Washington University in St. Louis

2:40 - 3:00 PM

Break 

 
Workshop Sponsor Session (Chair: Fred Stevie)

3:00- 3:20 PM

Physical Electronics 

3:20- 3:40 PM

Cameca Instruments 

3:40- 4:00 PM 

ION TOF 

4:00 PM

Workshop Outing – Walking Tour of the Alamo, Boat Trip on the Riverwalk, Dinner on your own. 

 

Friday – May 16, 2008

Technical Program


7:30 - 8:00 AM       Continental Breakfast 

Fundamentals

8:00-8:20 AM Decreased Photofragmentation using Strong-Field Femtosecond Laser Postionization, D. Willingham, Penn State University
8:20-8:40 AM Zero-Energy Depth Profiling?, Peter Williams, Arizona State University
8:40-9:00 AM C60 Bombardment of Solids: Atomistic, Mesoscale, Analytic Modeling and Depth Profiling Approaches, Barbara J. Garrison, Penn State University

 
Open Session

9:00 - 9:20 AM Secondary Ion Emission from Single Projectile Impacts on Nano-Objects, V. Pinnick, Texas A&M
9:20 - 9:40 AM Probing Surface Topography and Composition with Event-by-Event TOF-SIMS, Li-Jung Chen, Texas A&M
9:40 - 10:00 AM Advances in Organic Depth Profiling, Rudolf Moellers, IonTOF
10:00 - 10:40 AM  Break 
10:40 - 11:00 AM Optical Profiling vs. Stylus Profilometry: Advantages and Disadvantages for measuring SIMS Craters in PV Materials, 
M. R. Young, NREL
11:00 - 11:20 AM A Comparative Study of Cluster SIMS and MALDI MSI with Sublimated Matrix in the Investigation of Lipids in Biological Tissues, 
M. Passarelli, Penn State University
11:20 - 11:40 AM Inductively Coupled Plasma Source for Improved SIMS Performance, P. Tesch, Oregon Physics
11:40 - 12:00 PM Closing Remarks 
12:00 PM Close



Posters:

Depth Resolution Standards for Cluster SIMS Depth Profiling, Chris Szakal, NIST

Contaminant Analysis of Lithium Niobate Waveguide Devices using Three Dimensional Time-of-Flight Secondary Ion Mass Spectrometry, John A. Chaney and Russell A. Lipeles, The Aerospace Corporation

Improved Performance of Cs Ion Sputtering for Quadrupole SIMS, Christoph Schnouerer-Patschan, Cameca

Detailed Examination of Microstrips with C60 –SIMS in the Coincidental Mode, 
Li-Jung Chen, Texas A&M University

Effect of Low Energy Cs Implantation on Si Emission under Cluster Projectile Impacts, Zhen Li, Texas A&M University

(LiF)nF- Cluster Ion Emission from KeV Au Cluster Ion Bombardment, F.A. Fernandez-Lima, Texas A&M University

Making Metallic and Semiconductor Thin Films on Alkanethiolate Self-Assembled Monolayers: Characterization Using Time-of-Flight Secondary Ion Mass Spectrometry and Electron Microscope, Peng Lu, Washington University in St. Louis

Semiconductor Characterization using an IMS 1270 SIMS Instrument, Dave Simons, NIST

Mesa Sample Preparation for SIMS Profiling using an Automated Dicing Saw, T. Guenther, Freescale Semiconductor

Strategic Management of the SIMS Lab Resources Providing Support for Process Monitoring and Process Development of a Semiconductor Company, Thanas Budri, National Semiconductor Corporation 

3D Visualization for SIMS Analysis, S. E. Reichenbach, University of Nebraska

C60 Bombardment of Silicon - Comparison of SIMS and TEM, Greg Gillen, NIST 

The Annual Workshop on SIMS gratefully acknowledges the generous support of the following companies through the sustaining members program.


Sustaining Members/Exhibitors

Imago Scientific
KLA Tencor
IONOPTIKA

The following corporate sponsors have graciously helped to sponsor the Workshop’s welcome reception and lunches.

Cameca Instruments
ION-TOF GmbH
Physical Electronics
Evans Analytical Group


This workshop is co-sponsored by:

National Institute of Standards and Technology

Micron Technology

Department of Homeland Security, Science & Technology Directorate