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SIMS Workshop 1999 

Preliminary Program for 12th Annual Workshop on Secondary Ion Mass Spectrometry

This is a preliminary copy of the program. Everything may be changed without notice. Revision Data 4-8-99


Sunday April 25, 1999

6:00-9:00 PM, Registration, Vendor exhibit setup.

7:00-9:00 PM, Welcome Reception


Monday April 26, 1999

8:00 - 8:15 Welcome and Introduction - Greg Gillen and Richard Lareau

Tutorials on Applications of SIMS

8:15-8:45 Geological SIMS Tutorial- Eric Hauri , Carnegie Institute

8:45- 9:15 The Dirt on SIMS of Environmental Samples, Tony Appelhans, INEEL

SIMS Depth Profiling

9:15 -9:45 Recent Developments in Ultra-Shallow Depth Profiling - P. Ronsheim, IBM

9:45-10:05 Polymer Depth Profiling Studies, Yuri Strzhemechny, Queens College

10:05- 10:30 Break

10:30-10:50 Depth Profile Analysis of Si with Low-Energy and Oblique O2+ Beams - Z.X. Jiang, Institute of Microelectronics, Singapore

10:50-11:10 The Effects of Electron Irradiation on SIMS Depth Profiling, Chunsheng Tian, Charles Evans and Associates

Quantitative Analysis by SIMS

11:10-11:40 Quantitative Analysis of Semiconductors by SIMS - A Review, Fred Stevie, Lucent Technologies

11:40-12:10 Tutorial on High Precision Depth Profiling of Semiconductors —Jerry Hunter, Accurel

12:10-12:30 In-Situ Ion Implantation for Quantitative SIMS Analysis of Electronic Materials - Richard Lareau, Army Research Lab

12:30-1:30 Lunch

Novel Primary Ion Beams for SIMS

1:30-2:00 Probing the Formation of Secondary Ions Characteristic of Chemical Damage Using XPS and TOF-SIMS with Cluster Projectiles 0 M.J. Van Stipdonk, Texas A&M University, College Station, TX

2:00-2:20 TOF-SIMS with Slow, Highly Charged Projectiles-T. Schenkel, Lawrence Livermore Laboratory

2:20- 2:40 SIMS Using Polyatomic and Cluster Primary Ion Beams, Greg Gillen, NIST

2:40-3:00 Massive Cluster Ion Bombardment- Possible Applications for Surface Analysis and SIMS, David Fenner, Epion

3:00-3:30 Afternoon Break

3:30-5:00 Vendor Technical Presentations

Cameca- New Developments for the Cameca IMS 6F, M. Schuhmacher, Cameca Instruments


Atomika - Fast Profiling with the Atomika 4500, S. B. Patel, Atomika Instruments


5:00-6:30 Poster Session

Depth Scale Distortions in Shallow Implant SIMS Profiles, Fraser Reich, Physical Electronics

Automatic Primary Beam-to-Spectrometer Alignment in a Dynamic SIMS Instrument with sub-Monolayer Removal of Material, Fraser Reich, Physical Electronics

A Practical Approach to Deconvolution of SIMS Depth Profiles, Robert Odom, Charles Evans and Associates

Monitoring of Cleanroom Airborne Molecular Contamination by Time-of-Flight SIMS, Ian Mowat, Charles Evans and Associates

Depth Profiling of Shallow As in Si Using a Cameca IMS-6F Spectrometer Equipped with a Post Acceleration System, Georgin Guryanov, North Carolina State University

Profiling of Ultra Shallow P in Si with the Cameca IMS 6F, Rainer Loesing, North Carolina State University

SIMS Study of Diffusion Phenomena of Metal Elements Implanted into Silicon, Dan Zhou,, University of Central Florida

Ultra Shallow Depth Profiling on an Ion Microscope using Polyatomic Primary Ions, Greg Gillen, NIST

Ultra-Shallow Depth Profiling of Implants and Multilayer Samples using a modified Cameca IMS 4F, Jean-Claude Canry and Alan Brown, UMIST and CSMA

Computer Simulation of SNMS/SIMS Instruments in SIMION: Accurate 3D Modeling and Optimization of the Transmission, Igor V. Veryovkin, Argonne National Lab

Quantitative Trace Boron Determination in Steel via Imaging SIMS, William C. Horn, Exxon

Ion Trap SIMS Instrumentation and Surface Chemistry Studies, Gary Groenewold, INEEL

Characterization of Combinatorially Designed Polyarylates by TOF-SIMS, Anna M. Belu, Physical Electronics, Eden Prairie, MN

The 42 (CNO-) a.m.u. as Indicator of Internal Stresses in GaN Films on SiC (image SIMS)" A.P. Kovarsky, Surface Diagnostics Lab, R.A.C., St. Petersburg, Russia

Molecular Imaging of Membrane Systems using TOF-SIMS, M. Holland, Penn State

Effects of AlN Encapsulate in High-Temperature Annealing on Ion Implanted SiC as Characterized by SIMS, Peter Chi, NIST

Isotope Ratio Imaging of Interplanetary Dust Particles, Scott Messenger, NIST


7:00-8:00 Vendor Dinner

8:00- After Dinner Vendor Presentations

Presentating Companies (as of 3-18-99):

Accurel, Atomika, Cameca, Evans East, IonOptika, PHI and Peabody Scientific



Tuesday April 27, 1999


Biological, Polymer and Organic SIMS

8:00- 8:20 Gene Chip Technology Using SIMS Detection, Kenneth Willey, Atom Sciences

8:20 -8:40 Multivariate Statistics as an aid for interepretation of SIMS spectra from complex biological samples, Bonnie Tyler , Montana State

8:40- 9:20 Dynamic SIMS for Ion Transport and Therapeutic Drug Localization, Subie Chandra and Duane Smith, Cornell

9:20-9:40 Imaging SIMS Analyses of Soybean and Wheat Roots under Aluminum Stress, Mike Holland, Penn State

9:40-10:00 Break

10:00-10:20 Detecting, and Mapping of Calcium in Bone and Blood Using Secondary Ion Mass Spectrometry, Peter Todd, Oak Ridge Natl. Lab.

10:20-10:40 SIMS Analysis of Polymers, Papers and Other Household Products (or At Home with the Cameca IMS 4f), Alan Brown, CSMA Ltd.

10:40 - 11:00 Matrix Enhanced SIMS: A Method to Produce High Mass Organic Ions, Robert Odom, Charles Evans and Associates

Insulator Analysis by SIMS

11:00-11:30 The Role of the Near-Field in Sample Charging During SIMS– Dave Dahl, INEEL

11:30-11:50 Insulator Analysis in the Semiconductor Industry Using a Magnetic Sector SIMS Jennifer McKinley, Lucent Technologies

11:50-12:10 SIMS Analysis of Everything but Semiconductors, Charles Magee,
Evans East

12:10-12:30 Insulator Analysis using TOF-SIMS, Scott Bryan, PHI

12:30-1:30 Lunch

Novel Techniques/Semiconductor Applications

1:30-1:50 The Effect of Milling Parameters on Aspect Ratios Attainable in FIB Milled Features, Brenda Prenitzer, Univ of Central Florida, Orlando, FL

1:50 - 2:10 Trace Analyses of Platinum Group Elements Using a Primary Beam of Potassium, Hamed Abdulkawi, Arizona State University

Imaging SIMS

2:10-2:40 A Tutorial on Image Processing for SIMS - David Bright , NIST

2:40-3:00 High Sensitivity Direct Ion Imaging of Industrial Materials, W.A. Lamberti, W.C. Horn, H.C.Vidal, Exxon

3:00-3:30 Break

3:30-3:50 3D Imaging SIMS, Stewart McIntyre, University of Western Ontario

3:50-4:10 Exploiting the Complementary Nature of Different Chemical Imaging Techniques- K.G. Lloyd, DuPont, Wilmington, DE

4:10-4:30 Isotope Ratio Imaging by SIMS, Larry Nittler, NASA Goddard

4:30-5:00 Open Discussion on Any Topic of Interest to the SIMS Community

7:00- 9:00 Conference Banquet

8:15 After Dinner Speakers, Dr. Bill Stone and Dr. Barbara am Ende, US Deep Cave Diving Team


Wednesday April 28, 1999


8:00-8:30 SIMS Workshop Session

Workshop Report, Presentation on next year’s site, ASTM, Boron Delta Doped Structure Round Robin

SIMS Instrumentation

8:30- 9:00 Tutorial on Characterization and Operation of Channel Plate Detector, Bruce Laprade, Galileo Corp.

9:00- 9:20 A New Type of High Brightness Plasma Ion Source, Samar Guharay, University of Maryland

9:20- 9:40 The Generation of Low Energy Ion Beams for Sputter Depth Profiling - Noel Smith, Physical Electronics

9:40 -10:00 Break


10:00 - 10:45 Sample Preparation for Static SIMS Analysis: Tricks of the Trade, Fraser Reich, Physical Electronics

10:45 - 11:05 Characterization of CMP Wafers Using TOF-SIMS and Other Surface Analytical Techniques, Ian Mowat, Charles Evans and Associates

11:05- 11:25 Particle Analysis by TOF SIMS, A. Fahey , NIST

11:25- 10: 45 Investigating the Formation of a Copper-Coordinated Self-Assembled Bilayer Using Time-of-Flight SIMS, Chris Diehnelt, Texas A & M University

11:45-12:05 Inorganic Phase Identification by TOF-SIMS, Scott Bryan, Physical Electronics

12:05 - 1:00 Lunch (not included in registration fee)


SIMS Users Schools at the Marriott 1:00 - 5:00 PM — Specific details and times determined by company. This is a tentative outline reflecting our current understanding of the various schools. Subject to change at any time…….

Cameca Magnetic Sector SIMS Users School- Instructor Michel Schuhmacher

1. Low Impact Energy Operation under Oxygen Bombadment

        Experimental Parameters

        Acheivable Performance

2. Low Impact Energy Operation under Oxygen Bombardment

        Experimental Parameters

        Acheivable Performance

3. Insulator Analysis; Positive and Negative Modes

4. Open Discussion

PHI - TOF SIMS Users School 1:30-3:30 — Instructors Scott Bryan and Fraser Reich?

  1. Compound identification
  2. Spectral interpretation
  3. Depth profiling
  4. Insulating samples
  5. A rousing discussion; "Ask the Panel"

Cameca - ION TOF Users School- Instructor Birgit Hagenhoff ? Tascon

Schedule to be determined.


Thursday, April 29, 1999

8:00-10:00 Laboratory Tours of NIST and the Army Research SIMS Laboratories. The NIST Electron Beam Ion Trap (EBIT) Ion Source Facility will also be available for visits at this time.

10:00- 4:00 User training on Cameca xF and Cameca/ION TOF IV instruments at NIST and ARL

Tentative Outline for Cameca 4F User Training at NIST- Instructor Fabrice Deluigou

Session 1 10AM - 11AM — Basic Instrument Tuning
Secondary Optics

Primary Optics
High Current
Small Spot

Operation of the Dynamic Transfer System

Session 2. 11AM-12 PM - Instrument Calibration/Performance Checks

Raster Size Calibration
Calibration of Primary FC
EM Troubleshooting, Selection of Proper Bias voltage
Checking Presets
Characterizing Performance of Instrument - Visualizing Apertures ect..

Lunch NIST Cafeteria 12:00-1:00 PM

Session 3 1:00 PM - 2:00 PM - Vacuum Procedures

Discussion of Vacuum Safety Systems
Restart after Failure
Common Vacuum Problems
Bakeout Procedures/Issues

Session 4 2:00 PM- 2:30 PM - Introduction to NEG

Basic Operation

Session 5 2:30-3:30 PM - Basic Electronic Troubleshooting

10 Most Common Problems on 3F and 4F
Most common user mistakes (pumping with dp voltage on ect)


Tentative Outline for Cameca 6F User Training at ARL - Instructor : Michel Schuhmacher

  Session 1 10AM — 12PM —Instrument Tuning for Low Impact Energy Operation
Oxygen Bombardment

Lunch 12:00-1:00 PM TBD

Session 2 1:00 PM - 2:00 PM — Low Energy Operation
Cesium Bombardment

Session 3 2:00 PM- 3:00 PM - Introduction to NEG
Basic Operation and Tuning

Session 4 3:00-4:00 PM — Software/Open Discussion


Tentative Outline for Cameca ION-TOF IV User Training at NIST:

To be determined by ION TOF