Preliminary Program for 12th
Annual Workshop on Secondary Ion Mass Spectrometry
This is a preliminary copy of the program.
Everything may be changed without notice. Revision Data 4-8-99
Sunday April 25, 1999
6:00-9:00 PM, Registration, Vendor exhibit setup.
7:00-9:00 PM, Welcome Reception
Monday April 26, 1999
8:00 - 8:15 Welcome and Introduction - Greg Gillen and Richard Lareau
Tutorials on Applications of SIMS
8:15-8:45 Geological SIMS Tutorial- Eric Hauri , Carnegie Institute
8:45- 9:15 The Dirt on SIMS of Environmental Samples, Tony Appelhans, INEEL
SIMS Depth Profiling
9:15 -9:45 Recent Developments in Ultra-Shallow Depth Profiling - P. Ronsheim, IBM
9:45-10:05 Polymer Depth Profiling Studies, Yuri Strzhemechny,
10:05- 10:30 Break
10:30-10:50 Depth Profile Analysis of Si with Low-Energy and Oblique O2+
Beams - Z.X. Jiang, Institute of
10:50-11:10 The Effects of Electron Irradiation on SIMS Depth Profiling, Chunsheng Tian, Charles Evans and Associates
Quantitative Analysis by SIMS
11:10-11:40 Quantitative Analysis of Semiconductors by SIMS - A Review, Fred Stevie, Lucent Technologies
11:40-12:10 Tutorial on High Precision Depth Profiling of Semiconductors —Jerry Hunter, Accurel
12:10-12:30 In-Situ Ion Implantation for Quantitative SIMS Analysis of Electronic Materials - Richard Lareau, Army Research Lab
12:30-1:30 Lunch
Novel Primary Ion Beams for SIMS
1:30-2:00 Probing the Formation of Secondary Ions Characteristic of Chemical Damage Using XPS and TOF-SIMS with Cluster Projectiles 0 M.J. Van Stipdonk, Texas A&M University, College Station, TX
2:00-2:20 TOF-SIMS with Slow, Highly Charged Projectiles-T. Schenkel,
2:20- 2:40 SIMS Using Polyatomic and Cluster Primary Ion Beams, Greg Gillen, NIST
2:40-3:00 Massive Cluster Ion Bombardment- Possible Applications for Surface Analysis and SIMS, David Fenner, Epion
3:00-3:30 Afternoon Break
3:30-5:00 Vendor Technical Presentations
Cameca- New Developments for the Cameca IMS 6F, M. Schuhmacher, Cameca Instruments
PHI - TBD
Atomika - Fast Profiling with the Atomika 4500, S. B. Patel, Atomika Instruments
5:00-6:30 Poster Session
Depth Scale Distortions in Shallow Implant SIMS Profiles, Fraser Reich, Physical Electronics
Automatic Primary Beam-to-Spectrometer Alignment in a Dynamic SIMS Instrument with sub-Monolayer Removal of Material, Fraser Reich, Physical Electronics
A Practical Approach to Deconvolution of SIMS Depth Profiles, Robert Odom, Charles Evans and Associates
Monitoring of Cleanroom Airborne Molecular Contamination by Time-of-Flight SIMS, Ian Mowat, Charles Evans and Associates
Depth Profiling of Shallow As in Si Using a Cameca IMS-6F Spectrometer
Equipped with a Post Acceleration System,
Profiling of Ultra Shallow P in Si with the Cameca IMS 6F, Rainer
SIMS Study of Diffusion Phenomena of Metal Elements Implanted into Silicon,
Dan Zhou,,
Ultra Shallow Depth Profiling on an Ion Microscope using Polyatomic Primary Ions, Greg Gillen, NIST
Ultra-Shallow Depth Profiling of Implants
and Multilayer Samples using a modified Cameca IMS 4F, Jean-Claude Canry and Alan
Brown, UMIST and CSMA
Computer Simulation of SNMS/SIMS Instruments in SIMION: Accurate 3D Modeling
and Optimization of the Transmission, Igor V. Veryovkin,
Quantitative Trace Boron Determination in Steel via Imaging SIMS, William C. Horn, Exxon
Ion Trap SIMS Instrumentation and Surface Chemistry Studies, Gary Groenewold, INEEL
Characterization of Combinatorially Designed Polyarylates by TOF-SIMS, Anna
M. Belu, Physical Electronics,
The 42 (CNO-) a.m.u. as Indicator of Internal Stresses in GaN Films on SiC
(image SIMS)" A.P. Kovarsky, Surface Diagnostics Lab, R.A.C.,
Molecular Imaging of Membrane Systems using TOF-SIMS, M. Holland,
Effects of AlN Encapsulate in High-Temperature Annealing on Ion Implanted SiC as Characterized by SIMS, Peter Chi, NIST
Isotope Ratio Imaging of Interplanetary Dust Particles, Scott Messenger, NIST
7:00-8:00 Vendor Dinner
8:00- After Dinner Vendor Presentations
Accurel, Atomika, Cameca, Evans East, IonOptika, PHI and
Tuesday April 27, 1999
Biological, Polymer and Organic SIMS
8:00- 8:20 Gene Chip Technology Using SIMS Detection, Kenneth Willey, Atom Sciences
8:20 -8:40 Multivariate Statistics as an aid for interepretation of SIMS spectra from complex biological samples, Bonnie Tyler , Montana State
8:40- 9:20 Dynamic SIMS for Ion Transport and Therapeutic Drug Localization, Subie Chandra and Duane Smith, Cornell
9:20-9:40 Imaging SIMS Analyses of Soybean and Wheat Roots under Aluminum
Stress, Mike Holland,
9:40-10:00 Break
10:00-10:20 Detecting, and Mapping of Calcium in Bone and Blood Using
Secondary Ion Mass Spectrometry, Peter Todd,
10:20-10:40 SIMS Analysis of Polymers, Papers and Other Household Products
(or At Home with the Cameca IMS 4f), Alan Brown, CSMA Ltd.
10:40 - 11:00 Matrix Enhanced SIMS: A Method to Produce High Mass Organic Ions, Robert Odom, Charles Evans and Associates
11:00-11:30 The Role of the Near-Field in Sample Charging During SIMS– Dave Dahl, INEEL
11:30-11:50 Insulator Analysis in the Semiconductor Industry Using a Magnetic Sector SIMS Jennifer McKinley, Lucent Technologies
11:50-12:10 SIMS Analysis of Everything but Semiconductors, Charles Magee,
Evans East
12:10-12:30 Insulator Analysis using TOF-SIMS, Scott Bryan, PHI
12:30-1:30 Lunch
Novel Techniques/Semiconductor Applications
1:30-1:50 The Effect of Milling Parameters on Aspect Ratios Attainable in FIB Milled Features, Brenda Prenitzer, Univ of Central Florida, Orlando, FL
1:50 - 2:10 Trace Analyses of Platinum Group Elements Using a Primary Beam
of Potassium, Hamed Abdulkawi,
Imaging SIMS
2:10-2:40 A Tutorial on Image Processing for SIMS - David Bright , NIST
2:40-3:00 High Sensitivity Direct Ion Imaging of Industrial Materials, W.A. Lamberti, W.C. Horn, H.C.Vidal, Exxon
3:00-3:30 Break
3:30-3:50 3D Imaging SIMS, Stewart McIntyre,
3:50-4:10 Exploiting the Complementary Nature of Different Chemical Imaging
Techniques- K.G. Lloyd, DuPont,
4:10-4:30 Isotope Ratio Imaging by SIMS, Larry Nittler, NASA Goddard
4:30-5:00 Open Discussion on Any Topic of Interest
to the SIMS Community
7:00- 9:00 Conference Banquet
8:15 After Dinner Speakers, Dr. Bill Stone and Dr. Barbara am
Wednesday
April 28, 1999
8:00-8:30 SIMS Workshop Session
Workshop Report, Presentation on next year’s site, ASTM, Boron Delta Doped Structure Round Robin
8:30- 9:00 Tutorial on Characterization and Operation of Channel Plate Detector, Bruce Laprade, Galileo Corp.
9:00- 9:20 A New Type of High Brightness Plasma Ion Source, Samar Guharay,
9:20- 9:40 The Generation of Low Energy Ion Beams for Sputter Depth Profiling - Noel Smith, Physical Electronics
9:40 -10:00 Break
TOF-SIMS
10:00 - 10:45 Sample Preparation for Static SIMS Analysis: Tricks of the Trade, Fraser Reich, Physical Electronics
10:45 - 11:05 Characterization of CMP Wafers Using TOF-SIMS and Other Surface Analytical Techniques, Ian Mowat, Charles Evans and Associates
11:05- 11:25 Particle Analysis by TOF SIMS, A. Fahey , NIST
11:25- 10: 45 Investigating the Formation of a Copper-Coordinated
Self-Assembled Bilayer Using Time-of-Flight SIMS, Chris Diehnelt,
11:45-12:05 Inorganic Phase Identification by TOF-SIMS, Scott Bryan, Physical Electronics
12:05 - 1:00 Lunch (not included in registration
fee)
SIMS Users Schools at the Marriott 1:00 - 5:00
PM — Specific details and times determined by company. This is a
tentative outline reflecting our current understanding of the various schools.
Subject to change at any time…….
1. Low Impact Energy Operation under Oxygen Bombadment
Experimental Parameters
Acheivable Performance
2. Low Impact Energy Operation under Oxygen Bombardment
Experimental Parameters
Acheivable Performance
3. Insulator Analysis; Positive and Negative Modes
4. Open Discussion
Schedule to be determined.
Thursday, April
29, 1999
8:00-10:00
Laboratory Tours of NIST and the Army Research SIMS Laboratories. The NIST
Electron Beam Ion Trap (EBIT) Ion Source Facility will also be available for
visits at this time.
10:00- 4:00 User training on Cameca xF and Cameca/ION TOF IV instruments at
NIST and ARL
Tentative Outline for Cameca 4F User Training at
NIST- Instructor Fabrice Deluigou
Session 1 10AM - 11AM — Basic Instrument Tuning
Secondary Optics
LMR
HMR
Primary Optics
High Current
Small Spot
Operation of the Dynamic Transfer System
Session 2. 11AM-12 PM - Instrument Calibration/Performance Checks
Raster Size Calibration
Calibration of Primary FC
EM Troubleshooting, Selection of Proper Bias voltage
Checking Presets
Characterizing Performance of Instrument - Visualizing Apertures ect..
Lunch NIST Cafeteria 12:00-1:00 PM
Session 3 1:00 PM - 2:00 PM - Vacuum Procedures
Discussion of Vacuum Safety Systems
Restart after Failure
Common Vacuum Problems
Bakeout Procedures/Issues
Session 4 2:00 PM- 2:30 PM - Introduction to NEG
Basic Operation
Session 5 2:30-3:30 PM - Basic Electronic Troubleshooting
10 Most Common Problems on 3F and 4F
Most common user mistakes (pumping with dp voltage on ect)
Tentative Outline for Cameca 6F User Training at ARL -
Instructor : Michel Schuhmacher
Session 1 10AM — 12PM
—Instrument Tuning for Low Impact Energy Operation
Oxygen Bombardment
Lunch 12:00-1:00 PM TBD
Session 2 1:00 PM - 2:00 PM — Low Energy Operation
Cesium Bombardment
Session 3 2:00 PM- 3:00 PM - Introduction to NEG
Basic Operation and Tuning
Session 4 3:00-4:00 PM — Software/Open Discussion
Tentative
Outline for Cameca ION-TOF IV User Training at NIST:
To be determined by ION TOF